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Flange for Hubless Dicing Blades
Diamond Hub Dicing Blade

IDソーブレードは当初、主にゲルマニウムとシリコン半導体材料のスライスに使用されていました。 IDのこぎりの刃の大部分は、これらの材料の処理に今でも使用されています。現在、GGG、サマリウムコバルト、サファイア、磁性鉄、ガリウム砒素/リン酸塩、石英などの幅広い材料セットがIDソー技術を使用してスライスされています。

  • Nifec IDブレードは、お客様のニーズに固有の独自の最先端を備えたカスタム設計です。

  • トリミング・カットする素材でお客様のニーズに細心の注意を払い、それに応じてパラメータを調整します。

  • C(コアの厚さ)、K(切り口の厚さ)、D(ダイヤモンドの深さ)などのパラメーターは、お客様固有です。

  • IDブレードには最高品質の原材料のみを調達しています。

  • 一貫した製品を保証するために、業界で最も厳しい公差のいくつかを採用しています。

  • これらを含むがこれらに限定されない業界のすべての主要なサイズを供給します


The performance of Diamond ID dicing blades is vital in the semiconductor industry due to the precision required in cutting semiconductor wafers into individual chips. Several factors contribute to their performance:

  1. Cutting Precision: The blades need to make clean, accurate, and straight cuts through the semiconductor wafer material. Precision is crucial to ensure that each chip or die produced meets exact specifications.

  2. Edge Quality: The quality of the blade's cutting edge is critical. A well-maintained, sharp edge ensures clean cuts without causing damage or chipping to the chips being diced. Consistent edge quality is vital for consistent chip quality and yield.

  3. Material Compatibility: Diamond ID dicing blades are designed to cut through hard and brittle materials used in semiconductor manufacturing, such as silicon, gallium arsenide, and other semiconductor substrates. Their performance depends on efficiently cutting through these materials without causing micro-cracks or defects in the diced chips.

  4. Durability and Longevity: These blades should maintain their cutting efficiency and precision over extended periods. They need to withstand the high-speed cutting processes without losing their sharpness or wearing down quickly.

  5. Minimal Chipping and Material Loss: High-performance blades minimize chipping and material loss during the dicing process. This is crucial for maximizing the yield of usable chips from each semiconductor wafer.

  6. Compatibility with Dicing Equipment: Blades need to be compatible with the dicing machines used in semiconductor fabrication. They should fit securely and operate smoothly within these machines to ensure precise cutting and efficient production.

  7. Consistency and Yield: The performance of these blades directly impacts the overall yield and consistency of semiconductor chip production. Consistent performance ensures uniformity across all diced chips, minimizing defects and maximizing the number of usable chips from each wafer.

Regular maintenance, proper handling, and using blades within their recommended operational parameters are essential for optimizing their performance and longevity. Quality control measures are also crucial to monitor and ensure the blades' performance aligns with the desired standards for semiconductor chip manufacturing.


Diamond ID dicing blades are highly specialized tools used in the semiconductor industry, particularly in the process of dicing semiconductor wafers into individual chips or die. Here's a breakdown of their application:

  1. Semiconductor Wafer Dicing: These blades are used in the dicing process, where semiconductor wafers (made of materials like silicon, gallium arsenide, or other substrates) are cut into individual chips or die. This process is critical in semiconductor manufacturing, as it separates the numerous integrated circuits on a wafer into individual units that can be assembled into electronic devices.

  2. Precision Cutting: Diamond ID dicing blades are known for their precision and accuracy. They cut through the wafer material with exceptional accuracy, creating clean and precise cuts to avoid damage to the chips and ensure minimal material loss during the dicing process.

  3. High-Speed Dicing Machines: These blades are used in high-speed dicing machines that precisely position and move the blades across the surface of the semiconductor wafer. The diamond blades, along with the machinery, facilitate rapid and efficient dicing without compromising on accuracy.

  4. Advanced Materials: Diamond ID dicing blades are specifically designed to cut through hard and brittle materials commonly used in semiconductor fabrication. Their durability and ability to maintain sharpness make them suitable for cutting materials that would dull or damage conventional cutting tools.

  5. Quality Control: The precise cutting ability of diamond ID dicing blades ensures that the individual chips or die produced from the semiconductor wafers meet stringent quality control standards in terms of size, shape, and integrity.

  6. Chip Packaging: Once diced, these chips are packaged and assembled into various electronic devices such as microchips, processors, memory modules, and integrated circuits used in computers, smartphones, and various electronic products.

Diamond ID dicing blades play a critical role in the semiconductor industry, contributing to the production of high-quality and high-performance electronic components by enabling efficient and precise dicing of semiconductor wafers.

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Q: What are Diamond ID Dicing Blades?

Diamond ID dicing blades are specialized cutting tools used in semiconductor manufacturing for singulating semiconductor wafers into individual chips. They are designed with a circular shape and have a unique inner diameter (ID) configuration to fit specific dicing saw machines.
Q: How do Diamond ID Dicing Blades work?
Diamond ID dicing blades utilize diamond abrasive particles embedded in a metal or resin matrix to achieve high-precision cutting. As the blade rotates, the diamond particles on its edge grind through the wafer material, creating narrow saw cuts or "kerfs" between the chips, allowing them to be easily separated.
Q: What factors should be considered when selecting Diamond ID Dicing Blades?
When choosing dicing blades, factors such as blade diameter, thickness, grit size, bonding type (metal or resin), and cutting speed must be considered. The selection depends on the specific semiconductor material, desired kerf width, and cutting conditions.
Q: How can the performance of Diamond ID Dicing Blades be optimized?
To optimize blade performance, it's essential to ensure proper alignment and setup of the dicing saw machine, adequate cooling and lubrication during cutting, regular blade maintenance, and adherence to recommended cutting parameters provided by the blade manufacturer.
Q: What are Diamond ID Dicing Blades used for?
These blades are primarily used for precision cutting of semiconductor wafers made from materials like silicon, gallium arsenide, and silicon carbide. They help in separating individual integrated circuit (IC) chips from the wafer during the semiconductor manufacturing process.
Q: What types of semiconductor wafers can be diced using Diamond ID Dicing Blades?
These blades are suitable for dicing various types of semiconductor wafers, including silicon wafers used in microelectronics and photovoltaic applications, gallium arsenide wafers used in optoelectronics, and silicon carbide wafers used in power electronics and high-temperature applications.
Q: What are the advantages of using Diamond ID Dicing Blades?
Diamond ID dicing blades offer several advantages, including high cutting precision, minimal chipping or damage to the wafer edges, reduced kerf width for maximizing chip yield, and extended blade life compared to conventional dicing methods.
Q: Can Diamond ID Dicing Blades be reused?
Diamond ID dicing blades are typically designed for single-use applications due to the high precision required in semiconductor manufacturing. However, some blades may be suitable for limited reuse depending on factors such as blade condition and cutting requirements.
Diamond Abrasive Products
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